Standard: Q/JX 001-2015
No. | Item | Specification | |||
HHP-Ⅰ | HHP-Ⅱ | HHP-Ⅲ | HHP-Ⅳ | ||
1 |
Assay (%) ≥ |
30, 35 |
30, 35 |
30, 35 |
30, 35 |
2 |
Stability, % ≥ |
98 |
98 |
98 |
98 |
3 |
Nonvolatile matter , ppm ≤ |
30 |
20 |
20 |
10 |
4 |
Acidity /as H2SO4 , ppm ≤ |
50 |
30 |
30 |
30 |
5 |
Total organic carbon (TOC) , ppm, ≤ |
50 |
40 |
20 |
10 |
6 |
pH value |
1-4 |
2-4 |
2-4 |
2-4 |
7 |
Chloride (Cl), ppb, ≤ |
500 |
500 |
200 |
200 |
8 |
Sulfate (SO4), ppb, ≤ |
2000 |
2000 |
200 |
200 |
9 |
Phosphate (PO4), ppb, ≤ |
2000 |
2000 |
- |
- |
10 |
As, ppb, ≤ |
50 |
20 |
5 |
1 |
11 |
Pb, ppb, ≤ |
50 |
50 |
10 |
1 |
12 |
Sn, ppb, ≤ |
50 |
50 |
10 |
1 |
13 |
Fe, ppb, ≤ |
100 |
100 |
10 |
1 |
14 |
Cu, ppb, ≤ |
20 |
20 |
10 |
1 |
15 |
Ni, ppb, ≤ |
50 |
10 |
10 |
1 |
16 |
Mn, ppb, ≤ |
50 |
50 |
10 |
1 |
17 |
Cr, ppb, ≤ |
20 |
20 |
10 |
1 |
18 |
Al, ppb, ≤ |
500 |
100 |
10 |
1 |
19 |
Cd, ppb, ≤ |
50 |
50 |
10 |
1 |
20 |
Ti, ppb, ≤ |
100 |
50 |
10 |
1 |
21 |
Zn, ppb, ≤ |
100 |
50 |
10 |
1 |
22 |
Sb, ppb, ≤ |
20 |
20 |
5 |
1 |
23 |
Na, ppb, ≤ |
500 |
100 |
10 |
1 |
24 |
K, ppb, ≤ |
200 |
100 |
10 |
1 |
25 |
Ca, ppb, ≤ |
200 |
100 |
10 |
1 |
26 |
Mg, ppb, ≤ |
100 |
50 |
10 |
1 |
27 |
Number of particles /mL ≤ |
≥1μm, ≤25 |
≥0.5μm, ≤25 |
≥0.5μm, ≤25 |
≥0.5μm, ≤25 |
As a very important high pure chemical reagent in the microelectronic industry, Ultra-clean-high-pure hydrogen peroxide is mainly used as cleaning agent of semiconductor chip, corrodent and photoresist remover; used in electronic industry to produce advanced insulating layer, remove the inorganic impurities from plating liquid, as well as the handling of manufacturing process of copper, copper alloy, semiconductor material gallium, germanium, and Cathode Ray Tube; also used in the etching and cleaning of solar silicon wafers; due to the lethal effect of impurities on the chip, therefore the purity of Ultra-clean-high-pure hydrogen peroxide is very demanding.
Packing: 200kg/drum, 1000kg/drum, or following your demands.